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CMP Product

Our engineering capabilities enable us to embark on innovative solutions.

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In addition to the suite of services, we are excited to share a list of CIPs that may interest you.

Equipment

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  • Refurbishment

  • Local Slurry & Chemical Tank Fabrication

  • 200mm Obsoleted Parts

  • Installation & De-installation

  • Tool Startup

Parts Overhaul

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  • Robots & Controllers

  • Power Supplies

  • Motors & Controllers

  • Wet & Dry Pumps

  • Interface Boards (Analog & Digital)

  • Hardware Assemblies

Consumables

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  • Slurry (Cu, Barrier, Wcmp)

  • Post Clean Chemical

  • Hard / Soft Pad

  • Cleaner (Brushes, Gasket, Idler)

  • Heads (Retainer Rings, Membranes, Rolling Seals)

CIPs

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  • Customized projects & retrofits for improvement (quality & cost) in tools and facilities performances

CIP New Cross Cover Prevents Warpage

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  • Used cross cover will warp & rub against spindle, hence inducing wafer scratches

  • New design adds in latch key / increases thickness on cross cover to prevent the warpage

CIP New HPR Bar Improves Clean

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  • Extended diameter of HPR bar allows higher volume DIW for pad clean efficiency

  • Higher scale flow sensor 20L/min monitors HPR flow when volume is increased

  • HPR online monitoring system

CIP New LK Bar Brush Bearing Extends Lifespan

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  • New design LK quick exchange where a new type of bearing implemented 

  • Smooth torque & longer lifetime

  • Improved brush torque, reduces FDC/E3 torque OOC

CIP Dual IPA Spray Bar Improves Clean

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  • Doubles the row holes to 672 nos.

  • IPA ends modified from capped to through holes for ease to resolve problems of pressure distribution

  • 20-30% defect reduction because of increased IPA and better cleaning performance;

  • 30% WPH improvement because of improved dryer time (25-35secs);

  • 20-30% cost down;

  • 2-3 years extended life

CIP Modified Dry Crescent Eases Replaceability

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  • Modification enables roller only to be removed & replaced 

  • Reduces cost & risk of particle due to wear of roller

  • 97% cost down when the new sub-assembly can be replaced instead of complete crescent assembly

Right engineering solution with the right value

NanoStack

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